Design Intelligence

课程简介

Design Intelligence 课程名称：Master of Engineering Program in Design Intelligence 学位类型：Master of Engineering in Design Intelligence 修读模式：全日制 学制：2 年s 学费：港币400,000 开设学院/学系：Division of Integrative Systems and Design 官方网站：https://isd.hkust.edu.hk/academics/meng-in-design-intel/ 课程简介：The establishment of our MEng(DI) program is a forward-looking step toward nurturing a new generation of interdisciplinary innovators, design strategists, and creative technology connectors. The program enables studen

关键信息

入学要求

To qualify for admission, applicants must meet all of the following requirements. Admission is selective and meeting these minimum requirements does not guarantee admission. 1. General Admission Requirements of the University Applicants seeking admission to a master's degree program should have obtained a bachelor’s degree from a recognized institution, or an approved equivalent qualification. 2. English Language Admission Requirements Applicants have to fulfill English Language requirements with one of the following proficiency attainments: TOEFL iBT: 80 (for tests taken prior to 21 January 2026) * 4.5 (for tests taken from 21 January 2026 onwards) * TOEFL pBT: 550 TOEFL Revised paper-delivered test: 60 (total scores for Reading, Listening and Writing sections) IELTS (Academic Module): Overall score: 6.5 and All sub-score: 5.5 * * Refers to scores in one single attempt only. Test at home option is not accepted. Applicants are not required to present TOEFL or IELTS score if their first language is English, or they obtained the bachelor's degree (or equivalent) from an institution where the medium of instruction was English. 3. Program-Specific Admission Requirements A bachelor’s degree in design, technological areas, business, or related disciplines (e.g., communication, multimedia, psychology or ergonomics). 4. Additional Information Applicants with a bachelor’s degree in any of the following disciplines are preferred, including Product or Industrial Design, Fashion and Textiles, Multimedia Communication, Marketing, Artificial Intelligence, Data Analytics, Machine Learning, Software Engineering, or Industrial Engineering Applicants with working experience are at an added advantage but it is not compulsory. Applicants should submit a 500-word personal statement in English. Applicants should submit a portfolio (collection of recent design work, demonstrations, publications, personal website, Github repositories, etc.) in support of their applications. Applicants should submit a CV, proofs of qualification, academic transcripts, and awards, if any. 原文链接：https://prog-crs.ust.hk/pgprog/2027-28/meng-di/ 二、课程简介（英文原文） The establishment of our MEng(DI) program is a forward-looking step toward nurturing a new generation of interdisciplinary innovators, design strategists, and creative technology connectors. The program enables students to leverage artificial intelligence and digital technologies as a seamless extension of the design thinking process to create impactful, technology-driven products and services. Students will engage in advanced training that bridges the gap between deep tech and creative design, preparing them to drive profound societal and commercial impact. Candidates with a strong desire to lead innovation and a curiosity for digital transformation are ideal for this program. 三、学习目标（英文原文） On successful completion of the program, graduates will be able to: Develop and enhance individual design and creativity within the context of product and service/process design. Develop an appropriate set of professional design skills and related research methodology required in tackling and proposing solutions to contemporary industry issues. Acquire a global perspective regarding design strategies and business issues in a professional context. Continuously utilize and update the understanding and awareness of current and new developments in relevant technologies and practice within an integrated design context. Communicate effectively and professionally in verbal, digital, and visual formats, supporting managerial decision making in marketing and management. 四、课程设置（英文原文） Minimum Credit Requirement 36 credits Core Courses 12 credits Students are required to complete core courses from the following four integrated (4i) cluster areas: iProduct ISDN 5701 iService ISDN 5702 iConnect ISDN 5703 iMedia ISDN 5704 Elective Courses 12 credits Bridging Electives Students are required to complete 6-9 credits of bridging elective courses in the 4i cluster areas according to their academic backgrounds: i. IT/Engineering/Science: 6 credits, including ISDN 5711 and ISDN 5713 ii. Design: 6 credits, including ISDN 5712 and ISDN 5713 iii. Media: 6 credits, including ISDN 5711 and ISDN 5712 iv. Others: 9 credits, including ISDN 5711, ISDN 5712 and ISDN 5713 iProduct ISDN 5711 iService ISDN 5711 iConnect ISDN 5712 iMedia ISDN 5713 Other Electives Students can choose other elective courses from the following based on their career aspirations and personal interests. iProduct ISDN 5210 MTLE 5110 iService ISDN 5620 iConnect ISDN 5010 ISDN 5060 ISDN 5101 ISDN 5220 ISDN 5230 ISDN 5240 ISDN 5400 ISDN 5500 ISDN 5600 ISDN 5610 MTLE 5810 iMedia ISDN 5300 Capstone Project 6 credits ISDN 6730 Students are required to complete a 6-credit capstone project, choosing one of the three specialisms: Product-design focused, Service-design focused, or Research focused. Students will work individually or in group on the capstone project. Each capstone project will be supervised by at least one faculty member. Students are encouraged to associate their internship training with their capstone projects, and in such cases, the capstone project will be supervised or co-supervised by at least one faculty member and one industry expert. Internship Placement 6 credits ISDN 6740 Students are required to enroll in a year-long internship in Hong Kong, the Greater Bay Area or Shanghai, normally in the second year of study. Each internship will be co-supervised by one faculty member and one industry expert. Students are required to complete the capstone project while conducting the internship. Last update: 26 Aug 2026

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